US-TECHNOLOGY-ENGINEERING-RESEARCH-SEMICONDUCTOR
Taiwan and Poland are planning a collaborative effort to develop power gallium nitride (GaN) chip technology, combining their research and semiconductor industry resources to expand into markets for electric vehicles, energy, and high-power electronics. The image shown is for illustrative purposes only and does not represent the actual results of the collaborative project.

Taiwan, Poland to jointly develop GaN chips for EV and energy markets

Taiwan and Poland will cooperate on power gallium nitride (GaN) semiconductor technology, combining Taiwan's semiconductor manufacturing, packaging and testing expertise with Poland's research capabilities to expand into electric vehicle, energy and other high-power electronics applications. The initiative will open a new avenue for Taiwan's semiconductor industry to deepen cooperation with Europe.

According to an announcement by Taiwan's Ministry of Foreign Affairs, Foreign Minister Lin Chia-lung visited microelectronics and optoelectronics research institutions in Poland and announced that Taiwan would establish a cooperation program with Poland on power GaN chip technology. The two sides' representative offices are expected to sign a memorandum of understanding in the near future, after which the work will be jointly carried out by Taiwan's Industrial Technology Research Institute and relevant Polish research institutions.

GaN is a third-generation semiconductor material with high power density, high efficiency and suitability for high-frequency operation. It can be used in electric vehicle power conversion, charging equipment, energy systems and other power electronics devices. As electric vehicles and the energy transition continue to develop, power semiconductors are playing an increasingly important role in improving energy efficiency.

The Ministry of Foreign Affairs said the cooperation would combine the two sides' research capabilities and industrial resources, creating a model linking technology research and development, overseas applications and manufacturing needs. Taiwan is expected to contribute its established semiconductor manufacturing, packaging and testing capabilities, while Poland would participate in technology research and application development, creating further opportunities for cross-border industrial cooperation.

The initiative also represents an important step in Taiwan's efforts to expand semiconductor cooperation in Europe. Against the backdrop of global supply chains being reconfigured and countries strengthening their capacity for independence in critical technologies, Taiwan can continue developing advanced chip processes while expanding cooperation with European research institutions and industry in areas such as power semiconductors.

However, the cooperation program will need to proceed in stages, subject to the signing of the memorandum, research and development arrangements and industry demand. The actual technological outcomes, commercialization timeline and market scale remain to be announced by the two sides.