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The National Instruments Technology Research Center (NITC) of the National Applied Research Laboratories (NARL) has collaborated with Pan-Chuan Technology to overcome a bottleneck in the analysis of photoresist materials after high numerical aperture EUV lithography. This technology can assist in the detection of nanostructures on advanced process wafers, supporting the development of Taiwan's semiconductor supply chain. The image illustrates an advanced semiconductor manufacturing process.

【Taipei, October 27】The National Instruments Technology Research Center under the National Applied Research Laboratories and Marketech Technology have overcome a technical hurdle in analyzing photoresist materials after High Numerical Aperture Extreme Ultraviolet (High-NA EUV) lithography, providing new support for nanoscale structure inspection in advanced semiconductor manufacturing.

According to a report by the Central News Agency, the collaboration focuses on metal-oxide photoresists (MOR) used in High-NA EUV lithography. As integrated-circuit dimensions continue to shrink, accurately determining the size, profile and material changes of nanoscale structures after processing has become a major challenge for advanced chip manufacturing.

EUV lithography uses extremely short-wavelength light to create intricate circuit patterns on wafers. High-NA EUV further improves imaging capability, with the goal of supporting even finer circuit structures. Metal-oxide photoresists are a key material in the development of the technology, and combining them with High-NA EUV can help produce more precise circuit patterns.

The National Applied Research Laboratories said the research team used coating technology to reinforce nanoscale structures on wafers, making subsequent inspection and analysis easier. The technology can be used to observe wafer structures and chemical changes after lithographic exposure, helping researchers determine whether manufacturing results meet expectations.

NARLabs President Liu Hung-ying said the challenges facing advanced lithography involve not only producing circuit patterns, but also accurately verifying the results after processing is complete. As semiconductor manufacturing moves toward smaller line widths, inspection technology must advance in parallel to help manufacturers maintain process quality.

The laboratories said the achievement could also help Marketech Technology enter the process supply chains of major global semiconductor equipment suppliers and manufacturers. For the Taiwan semiconductor industry, in addition to wafer manufacturing itself, supporting technologies such as materials analysis, metrology equipment and process verification also play an important role in competition over advanced manufacturing.

However, a technological breakthrough does not mean it will be immediately adopted across all mass-production lines. Its commercial-scale deployment will still depend on customer requirements, inspection precision, process compatibility and the progress of mass-production validation.

As global chipmakers continue investing in advanced manufacturing, technologies capable of precisely analyzing materials and nanoscale structures after lithography will be an important link in improving process control and yields.